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Board thickness：rn≥2.0mm

G/F thickness：≤1.6mm±0.1mm

G/F tolerance：±0.05mm

Layer count：≤44 layers

Structure：Partially / fully embedded

Min coin size：2*2（mm)

Min coin thickness：0.5mm

Flatness between coin and base material：≤0.075mm

Material：AIN

Embedded Ceramic size：20*20（mm)

Professional technical support for thermal management：

Max board thickness：6.0mm

Max aspect ratio：25:1

Max gold thickness：80 u''

Warpage：≤4‰

Material：AIN

Embedded Ceramic size：20*20（mm)

Professional technical support for thermal management：